Insulation Coordination

Strokes Within the Span and the 0.6 Backflashover Factor

Backflashover studies usually assume the stroke hits the tower — but lightning can land anywhere along the shield-wire span. A span stroke creates a higher local voltage (starting near ZgI/2 as the current splits into two travelling waves), yet the span air gap is far stronger than the tower insulation, so flashover still tends to occur at the tower. This note works through span versus tower insulation, reflections and front time, the KTT ratio, and how every possible stroke location is folded into the single span-location factor that gives BFR = 0.6 NL P(I ≥ Ic).

Reading time ≈ 40 min

Section 1

Why Strokes Within the Span Matter

The first simplification in a backflashover study is to assume lightning terminates on the tower top or the shield wire at the tower. This is convenient because the tower-stroke case normally gives the highest tower voltage and the most severe insulation stress. But in reality a stroke can terminate anywhere along the shield-wire span, so a complete study must ask:

The question

What happens if the stroke hits the shield wire within the span rather than at a tower?

Two different flashover mechanisms

Span flashover: shield wire → phase conductor within the span. Tower flashover: tower/crossarm → phase conductor at the tower insulation. Although the maximum voltage may occur near the stroke point within the span, flashover is normally more likely at the tower, because the tower insulation path is much shorter and therefore weaker.

A span stroke can produce a voltage across the span air gap (shield wire to phase conductor), a voltage across the tower insulator string, travelling waves toward both adjacent towers, reflections from footings, and a possible flashover in the span or at the tower. The engineering result is that span strokes can cause flashovers, but tower flashovers remain dominant — and this is captured by a single span-location correction factor:

\[ \text{BFR} = 0.6\,N_L\,P(I \ge I_c) \]

The factor 0.6 accounts approximately for all possible stroke-termination points along the shield wire. This note explains where it comes from.

Section 2

Stroke to the Tower versus Within the Span

Stroke to the tower. The current enters the tower directly and divides between the tower body, the footing resistance and the shield wires to adjacent towers. The tower voltage rises quickly and stresses the tower-to-phase insulation — the classical backflashover case:

\[ V_{\text{ins}} = V_{\text{tower side}} - V_{\text{phase conductor}}, \qquad V_{\text{phase}} = C V_g \]

so higher coupling \(C\) lifts the phase conductor and reduces the stress. Stroke within the span. The current is injected between two towers, and the shield-wire voltage at the stroke point initially tries to rise to:

\[ V_{\text{stroke point}} \approx \frac{Z_g\,I}{2} \]

The factor \(\tfrac{1}{2}\) appears because the injected current splits into two travelling waves propagating in opposite directions — one toward each tower. The span stroke is therefore a travelling-wave problem. The key span-location variables used throughout this note are collected here:

Table 1 — Notation for the span-location travelling-wave analysis of stroke voltage.
SymbolMeaning
\(T_s\)One-way travel time of the full span
\(T_{sT}\)Travel time from the nearest tower to the stroke point
\(t_f\)Lightning current time to crest (front time)
\(Z_g\)Shield-wire surge impedance
\(I\)Lightning stroke current
\(K_{TT}\)Tower-voltage coefficient
\(K_s\)Span-location correction factor
\(I_c\)Critical current for the tower-stroke case
\(N_L\)Number of strokes terminating on the line / shield-wire system

Section 3

Defining the Stroke Location by Travel Time

The most useful way to define where the stroke lands is by travel time rather than distance:

Table 2 — Travel-time definitions locating the stroke along the span.
SymbolMeaning
\(T_s\)One-way travel time of the full span
\(T_{sT}\)Travel time from the nearest tower to the stroke point
\(T_s - T_{sT}\)Travel time from the stroke point to the opposite tower
\(t_f\)Time to crest (front time) of the lightning current
\[ \text{midspan: } T_{sT} = \tfrac{T_s}{2} \qquad \text{near a tower: } T_{sT} \to 0 \qquad \text{near far tower: } T_{sT} \to T_s \]

The location strongly affects when reflected waves return from the towers and how much they reduce the stroke-point voltage.

Section 4

Voltage at the Stroke Point

The voltage is highest at the stroke point, where the current is injected. Before reflections arrive it tries to reach \(Z_g I/2\), but reflections from the adjacent towers can pull the crest down — if they arrive before the current reaches its crest. The key timing condition is:

\[ t_f > 2\,(T_s - T_{sT}) \]

i.e. the round-trip reflection from the far tower returns at or before the current crest. So a slower front leaves more time for the helpful reflections:

Slow front helps

A slower front gives more time for tower reflections to return, which lowers the crest voltage at the stroke point.

Section 5

Span Insulation versus Tower Insulation

Along the span the voltage is largest at the stroke point and falls toward the towers:

\[ V_{\text{stroke point}} > V_{\text{intermediate}} > V_{\text{tower}} \]

But voltage magnitude alone does not decide flashover — what matters is the stress-to-strength ratio. And the two insulation paths are very different:

Table 3 — Comparing tower and span gap clearances for a 500 kV line.
PathInsulation DistanceNote
Tower (insulator string / air strike)≈ 3.35 m (500 kV example)Usually the weakest path
Span (shield wire ↔ phase)≈ 9.2 m (near tower) to 11.6 m (midspan)Much larger gap
\[ \frac{\text{span insulation strength}}{\text{tower insulation strength}} \approx 3.5 \]

So even when the span voltage is higher, the much stronger span insulation may still withstand it. The two paths compared side by side:

Table 4 — Span versus tower insulation paths compared side by side.
ItemSpan InsulationTower Insulation
Physical pathShield wire to phase conductor in the spanTower / crossarm to phase conductor
Voltage levelUsually higher, near the stroke pointLower than the stroke-point voltage
Insulation strengthMuch higher (larger spacing)Lower (shorter clearance)
Flashover likelihoodPossible but usually secondaryUsually dominant
Practical conclusionNormally neglected in BFR estimationMain reference case for \(I_c\)

Section 6

Why Span Flashover Is Usually Less Likely

Take a stroke at \(T_{sT}/T_s = 0.20\) with \(t_f = 2\,\mu\text{s}\) and \(R_i = 20\,\Omega\). The voltage ratio (midspan to tower) and the insulation-strength ratio are:

\[ \frac{V_{\text{span}}}{V_{\text{tower}}} \approx 2.4 \qquad \text{vs} \qquad \frac{\text{CFO}_{\text{span}}}{\text{CFO}_{\text{tower}}} \approx 3.5 \]
The core physical reason

The span voltage is higher (\(\times 2.4\)), but the span insulation is stronger still (\(\times 3.5\)). Because the strength rises more than the stress, flashover occurs at the tower, not in the span.

Section 7

Probability of Span Flashover

Considering all stroke-termination points, the chance of a span flashover depends strongly on the current front time:

Table 5 — How the current front time changes the span-flashover contribution.
Current front time \(t_f\)Approximate Span-Flashover Contribution
\(t_f = 2\,\mu\text{s}\)≈ 16%
\(t_f = 4\,\mu\text{s}\)≈ 2%

Slower fronts allow reflections from the adjacent towers to reduce the span voltage before the current crest. A faster front gives less time for reflections to cut the span voltage, so \(t_f\downarrow \Rightarrow V_{\text{span}}\uparrow \Rightarrow\) more span flashover; a slower front does the opposite. A second effect helps too: at high overvoltage, predischarge currents flow from the shield wire toward the phase conductor, inducing a phase-conductor voltage that reduces the gap stress:

\[ V_{\text{span gap}} = V_{\text{shield wire}} - V_{\text{phase conductor}}, \qquad V_{\text{phase}}\uparrow \Rightarrow V_{\text{span gap}}\downarrow \]

Predischarge therefore inhibits span flashover. It is hard to quantify by hand, but it reinforces the conclusion that span flashovers are not the dominant contribution.

Section 8

Tower Flashover Caused by a Span Stroke

Even without a span flashover, a span stroke still sends travelling waves to the towers, producing tower voltage and insulation stress. The decisive comparison is the tower voltage from a span stroke versus a direct tower stroke:

\[ V_{\text{tower, span stroke}} \le V_{\text{tower, tower stroke}} \]

The reason: a direct tower stroke injects the full severe current at the tower immediately, while a span stroke reaches the tower only after a travel delay — by which time part of the wave has propagated the other way, reflections have begun, and the crest is reduced. The two become comparable only when the relevant reflection has not yet acted before the crest:

\[ t_f \le 2\,(T_s - T_{sT}) \;\Rightarrow\; V_{\text{tower, span}} \approx V_{\text{tower, tower}} \]

but generally \(V_{\text{tower, span stroke}} < V_{\text{tower, tower stroke}}\).

Section 9

The KTT Ratio and the Span Critical Current

The tower voltage is represented by a coefficient \(K_{TT}\). The \(K_{TT}\) ratio compares the tower-voltage coefficient produced by a stroke within the span with the coefficient produced by a direct tower stroke, \(K_{TT,\text{span}}/K_{TT,\text{tower}}\). For a span stroke this coefficient is lower, and the ratio sits in a fairly narrow band:

\[ \frac{K_{TT,\text{span}}}{K_{TT,\text{tower}}} \approx 0.58 \text{ to } 0.77 \;\;\Rightarrow\;\; K_{TT,\text{span}} \approx 0.7\,K_{TT,\text{tower}} \]

So the tower voltage from a span stroke is about 70% of the direct-tower-stroke value. Because the tower voltage is lower, a higher current is needed to flash the tower:

\[ I_{c,\text{span}} \approx \frac{I_c}{0.7} \approx 1.43\,I_c \;\;\Rightarrow\;\; P(I \ge I_{c,\text{span}}) < P(I \ge I_c) \]

A significantly larger stroke is required, so the span-stroke contribution to the BFR is lower.

Section 10

The Span Factor Ks

To fold in all possible stroke locations, a span factor \(K_s\) compares the BFR over all locations with the BFR assuming every stroke hits a tower. It is not truly constant — it falls with the tower critical current:

Table 6 — How the span factor falls as tower critical current rises.
Tower critical current \(I_c\)Span factor \(K_s\)
50 kA≈ 0.63
200 kA≈ 0.42
Recommended single value0.6
Ks is not Ksp

Here \(K_s\) is the span-location factor. It should not be confused with \(K_{sp}\), the adjacent-tower (span) correction factor used elsewhere in the CIGRE backflashover calculation of the critical current.

The span factor is applied in two steps — the general form, the recommended value, and the practical result:

\[ \text{BFR} = K_s\,N_L\,P(I \ge I_c) \] \[ K_s \approx 0.6 \] \[ \therefore\quad \text{BFR} = 0.6\,N_L\,P(I \ge I_c) \]
Table 7 — Notation for the span-corrected backflashover-rate equation.
SymbolMeaning
\(K_s\)Span-location correction factor
\(N_L\)Number of strokes terminating on the line / shield wire
\(I_c\)Critical current for the tower-stroke reference case
\(P(I \ge I_c)\)Probability the lightning current exceeds \(I_c\)
The 0.6 does not mean 60% of strokes hit towers

The factor \(0.6\) is a span-location correction. It means that, after all possible stroke locations along the shield wire are considered, the resulting BFR is about 60% of the value obtained if every shield-wire stroke were treated as a direct tower stroke — so the tower-stroke assumption overestimates BFR, and 0.6 corrects it.

Section 11

CIGRE and IEEE Interpretation

In the CIGRE-style method the critical current \(I_c\) is computed for the tower-stroke case, then the 0.6 factor accounts for span-termination effects — replacing an explicit, per-location calculation with tower-stroke severity × span correction:

Table 8 — Notation for the CIGRE-style backflashover-rate formula.
SymbolMeaning
\(\text{BFR}\)Backflashover rate
\(0.6\)Span-location correction factor
\(N_L\)Number of strokes terminating on the line / shield wire
\(I_c\)Critical current for a tower stroke
\(P(I \ge I_c)\)Probability the lightning current exceeds \(I_c\)

CIGRE-style hand methods commonly fold stroke-location effects into a single span-location correction factor. IEEE-type and computer-based methods also recognise stroke-location effects, but the implementation depends on the adopted modelling procedure — they differ from CIGRE mainly in the wavefront treatment, footing-resistance reduction, corona, power-frequency angle and current distribution. In detailed travelling-wave or EMT studies the stroke location can be represented explicitly. On the span issue the physical conclusion is shared: a direct tower stroke is usually more severe, and span flashovers are secondary.

Section 12

What the Span Result Depends On

The span analysis assumes each insulation path can be represented by a non-standard CFO, \(\text{CFO}_{\text{NS}}\), taken (for a first approximation) proportional to the gap spacing — which is what lets us compare \(V_{\text{span}}/V_{\text{tower}}\) with \(\text{CFO}_{\text{span}}/\text{CFO}_{\text{tower}}\). A fuller CIGRE calculation makes \(\text{CFO}_{\text{NS}}\) depend on wave shape, gap length, leader progression, front and tail times and the tower/footing components. The main sensitivities:

  • Front time \(t_f\): fast fronts raise the span voltage (16% span flashover at \(2\,\mu\text{s}\) vs 2% at \(4\,\mu\text{s}\)) — fast-front lightning is the more severe case.
  • Span length: \(T_s = L_s/v\); longer spans delay the helpful reflections, so \(L_s\uparrow \Rightarrow T_s\uparrow \Rightarrow\) higher stress — consistent with span length increasing BFR.
  • Footing resistance: \(R_i\uparrow \Rightarrow V_{\text{tower}}\uparrow \Rightarrow \text{BFR}\uparrow\); the tower-footing reflection also feeds back into the span, so good grounding helps both tower and span strokes.
  • Shield-wire height: higher portions collect more strokes, so the spatial distribution is not perfectly uniform; including this lowers \(K_s\) slightly, but \(K_s = 0.6\) is kept for hand calculation.

Section 13

Practical Calculation Workflow

Span-corrected BFR workflow
  1. Compute the tower-stroke critical current \(I_c\) (tower surge, footing resistance, coupling, \(\text{CFO}_{\text{NS}}\), power-frequency voltage, adjacent-tower effects).
  2. Find the stroke-current probability \(P(I \ge I_c)\) from the lightning-current distribution.
  3. Estimate the exposure \(N_L\) from \(N_g\), line height, shield-wire spacing and length.
  4. Apply the span factor: \(\text{BFR} = 0.6\,N_L\,P(I \ge I_c)\).
  5. Use detailed stroke-location modelling only if spans are very long, towers very high, footing resistances high, reliability targets strict, on EHV/UHV optimisation, or with unusual geometry / underbuilt ground wires.

Section 14

A Common Misunderstanding

“Highest voltage is in the span, so it must flash in the span”

This is wrong. Flashover happens where the stress-to-strength ratio first reaches 1, not where the raw voltage is highest.

\[ \frac{V_{\text{span}}}{\text{CFO}_{\text{span}}} \quad\text{versus}\quad \frac{V_{\text{tower}}}{\text{CFO}_{\text{tower}}} \]

Even when \(V_{\text{span}} > V_{\text{tower}}\), it is usually still true that \(\dfrac{V_{\text{span}}}{\text{CFO}_{\text{span}}} < \dfrac{V_{\text{tower}}}{\text{CFO}_{\text{tower}}}\), because \(\text{CFO}_{\text{span}} \gg \text{CFO}_{\text{tower}}\). So tower flashover remains the more likely outcome.

Section 15

Engineering Conclusions

Table 9 — Key engineering conclusions on span versus tower flashover severity.
ConclusionWhy
Span flashovers are possible but usually minorSpan gap is much larger than the tower gap
Tower flashovers dominateTower insulation is usually the weakest point — BFR is mainly a tower problem
Span strokes still matterThey send travelling waves that stress the tower insulation
Span strokes are less severe than tower strokesTower voltage from a span stroke is ≈ 0.6–0.7 of a direct tower stroke
The CIGRE practical correction is 0.6Tower-stroke BFR × 0.6 instead of modelling every location

Section 16

Summary and Memory Map

Equation Summary
Stroke-point voltage
\(\displaystyle V_{\text{stroke point}} \approx \frac{Z_g I}{2}\)
Span travel time
\(\displaystyle T_s = \frac{L_s}{v}\)
Flashover condition
\(\displaystyle V_{\text{ins}} \ge \text{CFO}_{\text{NS}}\)
Tower voltage comparison
\(\displaystyle V_{\text{tower, span}} \le V_{\text{tower, tower}}\)
KTT ratio
\(\displaystyle \frac{K_{TT,\text{span}}}{K_{TT,\text{tower}}} \approx 0.7\)
Span critical current
\(\displaystyle I_{c,\text{span}} \approx \frac{I_c}{0.7} \approx 1.43\,I_c\)
Span factor
\(\displaystyle K_s \approx 0.6\)
Practical BFR
\(\displaystyle \text{BFR} = 0.6\,N_L\,P(I \ge I_c)\)

Memory map. Stroke hits the shield wire within the span → highest voltage near the stroke point → but the span air gap is much stronger → span flashover is possible but usually minor → travelling waves reach the tower → tower voltage is lower than a direct tower stroke → apply the span factor \(K_s \approx 0.6\) → \(\text{BFR} = 0.6\,N_L\,P(I \ge I_c)\).

Key messages
  1. A stroke can land anywhere on the span; the stroke-point voltage starts near \(Z_g I/2\) because the current splits into two travelling waves.
  2. Span voltage is higher than tower voltage, but the span gap is ≈ 3.5× stronger, so flashover usually occurs at the tower.
  3. Span flashover is front-time sensitive (≈ 16% at \(2\,\mu\text{s}\), ≈ 2% at \(4\,\mu\text{s}\)) and is further inhibited by predischarge currents.
  4. A span stroke gives a lower tower voltage (\(K_{TT}\) ratio ≈ 0.7), so it needs a higher current (\(I_{c,\text{span}} \approx 1.43\,I_c\)).
  5. All stroke locations are captured by the span factor \(K_s \approx 0.6\) — the tower-stroke assumption overestimates BFR, and 0.6 corrects it.
  6. Remember the result as tower-stroke critical current, corrected for real stroke locations along the span: \(\text{BFR} = 0.6\,N_L\,P(I \ge I_c)\).
Technical Documents

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